The Red Magic 10 Pro & Red Magic 10 Pro+ were officially launched in November last year in the Chinese market, featuring the Snapdragon 8 Elite chipset, a built-in cooling fan, no camera bump on the rear, and some impressive gaming features. The Red Magic 11 Pro series is all set to launch in the Chinese market on October 17, and while there is still a week left for the unveiling, the brand has shared the official renders of the phones.
Design-wise, the Red Magic 11 Pro series follows the design language of the Red Magic 10 Pro series. There is a boxy design that includes a flat frame and a flat display. There is no camera bump on the back, which is rare these days on smartphones. One of the biggest upgrades this year is the addition of an IPX8 rating. This is impressive considering the phone has a built-in cooling fan and those vents on the side. The cooling fan can spin at up to 24,000 rpm. There is a game space switch on the right, alongside the power button, the volume rockers, and the air vent.
One of the highlights of the Red Magic 11 Pro series is the built-in water-cooling system. Yes, we now have a water-cooled smartphone. One of the variants (probably the Red Magic 11 Pro+) will feature a transparent design on the back where we can see the water channels. Now, with such a small space for the water cooling system, it is hard to say how good it is going to perform in a smartphone. But as we know, something is better than nothing. It would be interesting to see the benchmarks of this device, as it has the latest Snapdragon 8 Elite Gen 5 chipset.
Speaking of the other specifications that we know, there is a massive 8,000mAh battery and up to 24GB of RAM with 1TB of storage. There are shoulder triggers on the side and an under-display ultrasonic fingerprint scanner.