Realme X9 Pro specs leaked, to feature Dimensity 1200 SOC
It will be one of the first phones powered by this SOC
It is raining SOCs as yesterday we got the Snapdragon 870 from Qualcomm, and now MediaTek has unveiled its two new flagship-grade chipsets named the Dimensity 1100 and 1200. As the names suggest, these are the most powerful SOCs under the Dimensity lineup so far. Realme has now officially announced that it will be one of the first smartphone brands to launch a phone powered by the Dimensity 1200 SOC. This was announced by Madhav Sheth, the CEO of Realme India and Realme Europe, on Twitter.
While Realme has not yet revealed the name of this phone, the company has already revealed that it is coming under the “X” series, and one of the highlights is going to be the ultra-sleek design. It might very well be one of the slimmest 5G phones when it launches. Anyways, as per Frandroid, this phone is named the Realme X9 Pro, and along with the Dimensity SOC, it would pack up to 12GB LPDDR5 RAM, a 108 Megapixel camera (the first on any Realme device) paired with two 13MP shooters, a 6.4-inch FHD+ 120Hz OLED panel & a 4,500mAh battery with 65W fast charging. Realme UI 2.0 runs out of the box which is based on Android 11.
Dimensity 1200 is built on the 6nm manufacturing process and comes with the Prime Cortex-A78 core clocked at up to 3.0GHz. There is a Mali-G77 MC9 GPU & an integrated 5G modem. This SOC seems like MediaTek’s reply to the Snapdragon 870 by Qualcomm.
Well, there is no information on the launch date yet, but Realme’s CEO is constantly posting teasers on his Twitter profile, so we may get to know the launch date soon.