MediaTek Dimensity 8300 specs revealed ahead of the launch

The successor to the Dimensity 8200!

MediaTek launched the Dimensity 9300 chipset earlier this month with all big cores. The company is now preparing to unveil its next high-end chip for the mid-range phones, the Dimensity 8300. As the name suggests, this is the successor to the Dimensity 8200, which we saw in a lot of phones this year, including iQOO Neo 7, Vivo V27 Pro, Vivo V29 Pro, iQOO Z8, Redmi Note 12T Pro, etc.

The Dimensity 8200 is quite a powerful chipset, easily beating the likes of Snapdragon 870, 888, 888+, etc. Now that the Dimensity 8300 is launching in a few days, it would be interesting to see how much of an improvement this new chipset brings over the predecessor.

Dimensity 8300 is launching on November 21
Dimensity 8300 is launching on November 21

Today, Digital Chat Station shared the specifications of this SOC on Weibo. As per the source, the Dimensity 8300 has a 1 + 3 + 4 core configuration for the CPU. There is one prime core clocked at up to 3.35GHz, three “big” cores clocked at 3.2GHz, and four “LITTLE” cores clocked at 2.2GHz. The Dimensity 8200 had a 1 + 3 + 4 core configuration (1x 3.1 GHz Cortex-A78 & 3x 3.0 GHz Cortex-A78 & 4x 2.0 GHz Cortex-A55) as well, but this time, we expect MediaTek to use ARMv9 cores.

The GPU is the Mali-G615 MC6, an upgrade over the Mali-G610 MC6 GPU in the Dimensity 8200.

Finally, the SOC is built on the TSMC’s 4nm N4 process.