Earlier this month, MediaTek unveiled the world’s first SOC built on the 4nm manufacturing process, the Dimensity 9000. This chip features the Cortex-X2 CPU core and scores over a million on the AnTuTu benchmark. In short, this is MediaTek’s highest-end offering for next year. Well, apart from this SOC, there are also some other less powerful chipsets that the company will launch, and one of them is the MediaTek Dimensity 7000. Today, the specifications of this SOC were shared by Digital Chat Station on Weibo.
Starting with the manufacturing process, the Dimensity 7000 SOC is built on the 5nm process. So far, there are not a lot of SOCs in the market built on the 5nm process. Some of the names include Snapdragon 888/888+, Exynos 2100, Apple A15 Bionic, and the Kirin 9000.
In terms of the CPU, the Dimensity 7000 has an 8-core CPU where there are four performance-centric Cortex-A78 cores clocked at 2.75GHz & four efficiency-based Cortex-A55 cores clocked at 2.0GHz. Now, the Dimensity 1200 had the same Cortex-A78 cores, but the arrangement was quite different. That chip had one main Cortex-A78 core clocked at 3.0GHz and three Cortex-A78 cores clocked at 2.6GHz.
And finally, the MediaTek Dimensity 7000 SOC has the Mali-G510 MC6 GPU, and this GPU was unveiled by ARM this year in March alongside the other GPUs such as G710 and the G310. The Mali G510 is a successor to the Mali-G57 GPU of 2019. ARM calls this GPU the perfect balance of performance and efficiency.
Well, the Dimensity 7000 seems like a chipset for upper mid-range phones, something similar to Qualcomm’s Snapdragon 870 this year. We are expecting phones with Dimensity 7000 to arrive as early as Q1 2022.