The MediaTek Dimensity 8300 chipset was officially launched in November last year with up to 20% better CPU and 60% better GPU than its predecessor. The chipset was used in a few smartphones, including the Poco X6 Pro (Redmi K70E), and the Xiaomi 14T. Last month, the brand unveiled the Dimensity 8350 SOC which is almost identical to the Dimensity 8300, with the only exception being the new StarSpeed Engine for gaming, versus HyperEngine in the 8300.
The MediaTek Dimensity 8400 is all set to launch soon and the specifications of the chipset were shared by Digital Chat Station on Weibo.
Unlike the Dimensity 9400, the Dimensity 8400 is manufactured on TSMC’s 4nm process. One big upgrade is that the CPU now uses an all-big core design, similar to the Dimensity 9400 SOC. The eight-core CPU has one prime Cortex-A725 core clocked at up to 3.25GHz, three Cortex-A725 cores clocked at up to 3.0GHz, and four Cortex-A725 cores clocked at up to 2.1GHz. So, the CPU uses the Cortex-A725 for all eight cores.
For comparison, the MediaTek Dimensity 8300 featured four Cortex-A715 cores and four Cortex-A510 cores. It is worth mentioning that the Dimensity 8300’s CPU could go up to 3.35GHz, versus 3.25GHz in the upcoming Dimensity 8400.
The GPU is the Immortalis G720 MC7 with a frequency of up to 1.3GHz. For comparison, the MediaTek Dimensity 8300 featured an ARM Mali-G615 MP6 GPU.
As per Digital Chat Station, the MediaTek Dimensity 8400 scores over 1.8 Million points on the AnTuTu benchmark. For comparison, the Snapdragon 8 Gen 3 scores around 2 Million points on the AnTuTu benchmark, so it shows how powerful the Dimensity 8400 is going to be.
Well, there is no information on when the Dimensity 8400 will be launched. As for the smartphones powered by this chipset, we may get the Poco X7 Pro in the global market with the MediaTek Dimensity 8400 chipset since the Poco X6 Pro had the Dimensity 8300-ULTRA.