Xiaomi Mi 9 is going to be a huge upgrade from last year’s Mi 8 as there are some significant changes, not just in the internals but also in the design. We already know that the bottom chin is now 40% narrower than the Mi 8’s and there is now a smaller waterdrop notch on top. The back now has a triple camera setup, and the phone has an in-screen fingerprint reader.
Today, the Co-Founder of Xiaomi, Lei Jun, revealed the key specifications of the Xiaomi Mi 9’s camera on his Weibo page. We already know that the primary camera on the rear is a 48MP Sony IMX 586 sensor. But, Lei Jun revealed some detailed specs of each camera.
So, the primary 48MP camera has an f/1.75 aperture, 0.8-micron pixel size & it is a half an inch sensor. There is Pixel binning as well that combines four pixels into one, resulting in a 12MP image with 1.6-micron pixel size. Unlike the Samsung GM1 sensor, the IMX 586 is truly a 48MP sensor.
The secondary rear shooter is a 12MP Telephoto camera with f/2.2 aperture, 1.0-micron pixel size, and 2X Optical Zoom. It is used mainly for the Portrait Mode images.
There is the third 16MP Wide-angle camera with f/2.2 aperture, 110-degree FOV, 1.0-micron Pixel size and ability to take 4cm macro shots. We were expecting this third camera to be a 3D ToF sensor, but that might be the case with the transparent version of the Xiaomi Mi 9 that has four rear cameras.