Xiaomi 14 has thinner bezels than iPhone 15 Pro Max
The first look was shared by Xiaomi on Weibo!
Xiaomi 14 Series and the new HyperOS are launching on October 26 in the Chinese market, and today, Xiaomi gave us our first look at its upcoming flagship. The official images of the phone were shared by the brand on Weibo, and there are some interesting design upgrades compared to the Xiaomi 13.
The camera module design is slightly different this time. While it is still a square-shaped camera module with triple cameras, the placement differs from the Xiaomi 13. The LED flash module gets its separate circular housing, which makes the camera module look more symmetrical than the Xiaomi 13’s. There is no change on the sides since the Xiaomi 14 has the same shiny flat frame design.
The phone has a flat display on the front with a hole punch cutout in the center, the same as the Xiaomi 13. But this year, Xiaomi has trimmed down the bezels even further. In fact, the phone has slimmer bezels than the iPhone 15 Pro Max. The top and side bezels measure 1.61mm (vs 1.75mm on the iPhone), and the bottom bezel is just 1.71mm (vs 1.75mm on the iPhone). The display size remains the same as last year – 6.36-inch. But, because of even slimmer bezels, the phone has a slightly smaller footprint than the Xiaomi 13.
You will also notice that the Xiaomi 14 has no holes for the IR blaster, mic, or secondary speaker on the top. As per Lei Jun, Xiaomi put the IR blaster in the camera module, and the microphone is placed inside the front earpiece cutout. For the secondary speaker, Xiaomi says it used the “micro-slit” design to hide it.
Well, design-wise, the Xiaomi 14 looks stunning! Let’s see at what price Xiaomi launches the device.