Yesterday we got to know the design & specifications of an upcoming 5G phone from Redmi & some sources have claimed that this is the Redmi Note 10. While the name is a mystery, we know that the SOC powering this device is the MediaTek Dimensity 820 which is not yet official. On May 18th, MediaTek is going to launch a new 5G Chipset so the Dimensity 820 might launch that day in China.
Talking about the specifications first, the MediaTek Dimenity 820 chipset has an octa-core CPU featuring 4x Cortex-A76 cores (Performance) clocked at 2.6GHz & 4x Cortex-A55 cores (Efficiency) clocked at 2.0GHz. There is Mali-G57 GPU & the Dimensity 820 chipset is built on the 7nm manufacturing process.
The closest competition to this chipset is the Kirin 820 from Huawei & Snapdragon 768G from Qualcomm, both of which are based on 7nm process & feature an integrated 5G modem.
The Geekbench scores of these three chipsets are not much different. In terms of the single-core performance, the Snapdragon 768G seems to be the better one among the three as it scores the highest. But, in case of the multi-core performance, the Dimensity 820 SOC beats the other two. The scores are extremely close when we compare the Dimensity 820 & Kirin 820.
It is worth mentioning that both Dimensity 820 & Kirin 820 have the same Mali-G57 GPU, although there might ve a difference in the frequency. Here is the core arrangement for each of the three chipsets –