MediaTek launched its Dimensity 8000 series today, and there are two new SOCs under this series – 8000 & 8100. As the names suggest, the 8000/8100 are positioned below the Dimensity 9000, which is the top-of-the-line SOC from MediaTek for 2022. MediaTek says these new SOCs are for the premium 5G phones, and both of them borrow some technologies from the Dimensity 9000 platform.
Speaking of the similarities first, both the chipsets are built on the 5nm TSMC process and support WiFi 6E and Bluetooth 5.3. There is support for a single 200MP sensor and 4K 60fps (HDR10+) dual recording. LPDDR5 RAM and UFS 3.1 storage is supported by both chips.
In terms of the CPU, both have the same core configuration, but the clock speeds are slightly different. Both the SOCs have an octa-core CPU with four Cortex-A78 cores and four Cortex-A55 cores. The Cortex-A55 cores are clocked at 2.0GHz for both of them, but the Cortex-A78 cores are clocked at 2.75GHz for the Dimensity 8000 and 2.85GHz for the Dimensity 8100. Both the SOCs have the Mali G610 GPU, but the one inside Dimensity 8100 is 20% faster.
Another difference comes in the display support. While both the SOCs support up to a 168Hz Full-HD+ display, the Dimensity 8100 can also support a 120Hz WQHD+ panel. There is a MediaTek APU 580 in both the SOCs, but the one inside Dimensity 8100 offers a 25% frequency boost.
And well, those are all the differences between the two chipsets. Everything else remains the same, whether it is the modem (3GPP Release 16), ISP, connectivity options, audio, storage, etc.
MediaTek says that we can expect phones powered by the Dimensity 8000 and Dimensity 8100 SOCs in the first quarter of 2022, which pretty much means that we are getting some new phones with these SOCs this month. Realme GT Neo 3 and Redmi K50 Pro are officially confirmed to be one of the first powered by the Dimensity 8100 SOC.