MediaTek Dimensity 1050, Dimensity 930 & Helio G99 launched

MediaTek currently has two main series of smartphone chipsets, the Helio G series & the Dimensity 5G series. One includes chipsets for budget phones focusing on performance, whereas the other includes chipsets with 5G support and high-end features. The company just launched three new SOCs named the Dimensity 1050, Dimensity 930 & the Helio G99. As the names suggest, 1050 is for the premium mid-range phones, the 930 is the successor to Dimensity 920 & hence is for the lower mid-range devices & the G99 is the successor to the Helio G96 and hence is for the budget phones.



Starting with the most powerful among the trio, the Dimensity 1050 sits somewhere between the Dimensity 1000 & Dimensity 1100, at least that’s what the name suggests. One of the highlights of this new chip is that it is the first Dimensity series SOC that supports both sub-6GHz & mmWave 5G. Even the flagship Dimensity 9000 lacks the mmWave 5G support. The Dimensity 1050 is built on the TSMC’s 6nm process & can seamlessly switch between sub-6GHz & mmWave 5G. It can connect to both simultaneously, which results in 53% faster speeds than other SOCs that can only connect to 4G LTE & mmWave simultaneously.

The CPU includes eight cores, two of which are the high-performance Cortex-A78 cores clocked at up to 2.5GHz. There are six Cortex-A55 cores clocked at up to 2.0GHz. The GPU is Arm Mali-G610 MC3, and there is support for LPDDR5 RAM + UFS 3.1 storage. The chip comes packed with the MediaTek MiraVision 760 and hence supports up to a 144Hz FHD+ display, 10-bit color depth, HDR10+, Dolby Vision, and more.

For AI tasks, there is the MediaTek APU 550, and for imaging, there is Imagiq 760 HDR-ISP.

MediaTek says the first smartphones powered by Dimensity 1050 will be available in Q3 2022.



Next up, we have the successor to the Dimensity 920, the Dimensity 930. Interestingly, even though this is a successor to the Dimensity 920, the CPU clock speeds have been reduced. There are still two Cortex-A78 cores for performance, but the clock speed now goes up to 2.2GHz compared to 2.5GHz. The six Cortex-A55 cores have a clock speed up to 2.0GHz, so that remains unchanged. There is support for LPDDR5 RAM and UFS 3.1 storage, like the predecessor.

So, what is upgraded? Well, the Dimensity 930 supports 120Hz Full-HD+ displays with HDR10+ support. There is also an upgraded 5G modem that results in faster speeds and greater reach. There is no mmWave 5G support, however.

MediaTek says the first smartphones powered by Dimensity 1050 will be available as soon as next month.



Finally, we have the Helio G99, a non-5G chipset for budget phones. One of the biggest upgrades over the Helio G96 is the manufacturing process. While the Helio G96 was based on the 12nm process, the Helio G99 is built on the TSMC’s 6nm process, making it the first Helio G series SOC built on the 6nm process. This means a significant performance boost, as well as a lot better power efficiency.

MediaTek also upgraded the maximum clock speeds of the high-frequency cores. The two Cortex-A76 cores are clocked at up to 2.2GHz, compared to 2.05GHz. There are six Cortex-A55 cores clocked at up to 2.0GHz, the same as the predecessor.

Well, apart from these upgrades, the other features are almost the same as Helio G96.

We will get phones powered by the Helio G99 SOC in Q3 2022.

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