Last year at the MWC Barcelona, LG unveiled two phones named LG G8 ThinQ & LG V50 ThinQ 5G. While they received a mixed response from the audience, LG isn’t going to stop anytime soon. The LG G9 ThinQ is going to launch soon & the company may unveil it at the CES 2020. Today, the CAD renders of the G9 ThinQ were shared by OnLeaks in collaboration with CashKaro.
The CAD renders reveal that the phone has a display with a tiny U-shaped notch on top. So, LG seems to have no plans to go for a full-screen design of a punch-hole display. Like the LG G8 ThinQ, the G9 definitely has an OLED panel. While the G8 ThinQ had a Crystal Sound OLED panel (sound coming through the screen), the LG G9 ThinQ has an earpiece on top.
On the rear, the G9 has a Quad camera setup placed horizontally & unlike the G8 ThinQ that had a physical fingerprint scanner on the rear, the G9 seems to have one under the display (Not Confirmed, though). As per the source, the display size is going to be around 6.7-6.9-inches.
It seems like in 2020, LG would be one of the few smartphone manufacturers to include a 3.5mm headphone jack in its flagships. Yes, the LG G9 ThinQ has a headphone jack on the bottom alongside the USB Type-C port & the speaker grill. So that’s nice to see. Moreover, since there is a headphone jack, there is no doubt the phone has Hi-Fi Quad DAC, something that is appreciated by everyone.
The specs are unknown, but it won’t be a surprise if this phone launches with Snapdragon 865 SOC.