LG G8X CAD renders reveal no camera bump & a headphone jack
At the MWC Barcelona in February, LG unveiled its flagships, the G8 ThinQ & the V50 ThinQ 5G. Now, the company is all set to launch yet another flagship, named the LG G8X, and it is expected to launch at the IFA Berlin. The CAD renders of the phone were shared by OnLeaks in collaboration with Pricebaba & they reveal the design from every angle.
LG is now one of the only few companies that still add a headphone jack in their phones & the G8X is no different. It does have a headphone jack placed on the bottom & like previous LG flagships, it also features the Quad-DAC, which is the reason why an LG flagship is recommended if you want the best audio quality via wired headphones or earphones. The USB Type-C port is also placed on the bottom along with the speaker grill.
Almost every flagship launched this year has a camera bump, but the story is completely different from the LG G8X. It has no camera bump since the dual cameras, and the flash are placed underneath the rear glass which makes the whole back feel super smooth. On the front, there is a U-Shaped notch that houses the single front camera. So, no hole-punch or pop-up camera is there.
Now, the lack of a fingerprint reader on the back means that there is an OLED display on the front & the fingerprint scanner is placed under it.
The LG G8X has a display with a size roughly around 6.2-inch. So, there is not a huge difference in terms of the display size when compared to the G8 ThinQ’s 6.1-inch panel. The dimensions of the phone are 159.3 x 75.8 x 8.5mm. There is an earpiece on top that means LG is not going for the screen sound tech here like the LG G8 ThinQ. Also, the phone does have an extra button on the left side, most likely for the Google Assistant.
Now, if it is indeed a flagship, then it is expected to feature Snapdragon 855+ SOC. Since there are two cameras on the back, it is definitely a combination of a normal lens & a wide-angle lens.
The phone LG G8X will be unveiled at the IFA 2019 in Berlin.